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electroplating of gold process

sulfite plating in the gold electroplating bin on the shelves. 2.2.3.1. Mergasin, et al (see citation at top of SOP) found the optimal process 2conditions for low stress to be 3.5 mA/cm and 58 oC. Stress was found to vary strongly with both parameters. You may need to experiment with the process parameters to achieve best results. 2.3. Gold plating

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